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Hu ICP (bei) 05123703

Rigid Board Capability
Base Material Thk. D.S. 0.2-3.2mm
MLB 0.4-3.2mm
Max. Board Size D.S. 700*800mm
MLB 600*800mm
Monthly Capacity Rigid PCB 10,000O(DS&Multi-Layer)
Hole Dia. Tolerance NPTH 0.05mm
PTH 0.076mm
Min. Hole Diameter 0.1mm
Min. Hole to Hole Tol. 1mil
Min. L/Width L/spacing 4 mil
Solder Mask Hardness 6H
Surface Finish Immersion gold/Immersion Silver/Immersion tin/Lead-free HASL/Gold plating/OSP
Outline Tolerance CNC Rout 0.1mm
Punch 0.13mm
V-cut Min. Board Thk. 0.4mm
E-test Voltage:10-300v;Insulation Resistance:1-20M;
Peel off Strength 1.4N/mm
Thermal shock Resistance 260 10sec 3times
Flammability Rate 94V-0
Warp and Twist 1%
Quality Standard GB4588.2;GB4588.4;IPC-600G, Class II/AQL-