制程能力

Rigid Board Capability

Item

Parameter

Base Material Thk.

D.S.

0.2-3.2mm

MLB

0.4-3.2mm

Max. Board Size

D.S.

700*800mm

MLB

600*800mm

Monthly Capacity

Rigid PCB

10,000m2(DS&Multi-Layer)

Hole Dia. Tolerance

NPTH

±0.05mm

PTH

±0.076mm

Min. Hole Diameter

0.1mm

Min. Hole to Hole Tol.

±1mil

Min. LTWidth Uspacing

4 mil

Solder Mask Hardness

>6H

Surface Finish

OSP Gold plating Immersion tin Immersion gold Lead-free HASL Immersion Silver

Outline Tolerance

CNC Rout

±0.1 mm

Punch

±0.13mm

V-cut Min. Board Thk.

0.4mm

E-test

Voltage:10-300v; Insulation Resistance:1-20MΩ;

Peel off Strength

1.4N/mm

Thermal shock Resistance

260°C 10sec 3times

Flammability Rate

94V-0

Warp and Twist

<1%

Quality Standard

GB4588.2;GB4588.4; IPC-600G, Class ll/AQL- II